Plasma-Therm continues to see strong momentum for the Shuttleline® platform, supporting advanced research environments through flexible, high-performance PECVD processing.
The Shuttleline platform is designed for flexibility across varying substrate sizes, making it well suited for dynamic R&D environments. Its configuration enables consistent process performance and high-quality thin-film deposition.
With PlasmaBox™ PECVD integration, the Shuttleline platform supports applications across semiconductor research, advanced materials, and emerging technologies.
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