High Vacuum Deposition Systems

In all SE/SEC-Series systems, the baseplate (typically 20 inches) accommodates up to 15 feedthroughs for instrumentation, control and rotary motion. SE/SEC-600 systems are most often equipped with a 19.5″ diameter bell jar and Planetary Fixturing having a capacity of 18 4″ wafers. The average pumpdown time of less than 30 minutes allows throughput in excess of 54 wafers per hour.

Ultimate vacuum: 10 -8 torr range

• Cryogenic pump: 8″
• Mechanical pump: 23-57 CFM, dual stage
• Cold trap: 2.5 liter capacity, 200 sq. inches of surface area, 10 hours holding time
• Water baffle: Optically dense, chevron baffle
• High vacuum valve: 7-3/4″ I.D., seals vertically
• Foreline/Roughing valves: 3″ I.D.
• Valve actuation: Electro-pneumatic (all vacuum valves)
• Valve sequencing: Manual and automatic (Auto-Tech II)
• Ionization gauge control: Dual ionization gauge tube, auto ranging with dual convectron positions.
• Dimensions: 79″H x 43″W x 37″D
• Weight: 1,200 pounds
• Utilities
  • Electrical: 208/10/70A/4-wire connection with ground (3 phase, 5-wire also available)
  • Water: 10 GPM (minimum)
  • Air: 90-110 PSIG
    
    
• Options:
  • Diffusion pump: 2400 liter/second, 6″ normal
  • Process chamber: 19.5″ diameter x 30″ H, ambient or water-cooled (larger bell jars available)
  • Fixturing: Variety of fixturing options: planetary, clamshell, or custom.
  • Baseplate: 20″ or 26″ diameter, 7-3/4″ pumping port
  • Substrate heat:2-10 kW
  • Sources: Any commercially available source, including single and multiple beam, CHA’s resistance and sputtering sources.
  • Hoists: Motorized hoist assembly, 1/4HP motor
  • LN2 Level Control: Automatically maintains liquid level in cryogenic trap.
  • Sieve trap: Molecular sieve trap prevents migration or backstreaming of mechanical pump oil into the system.
  • RGA port: 2.75 O.D. flange located in base plate of system provides integration of a residual gas analyzer.
  • Automatic deposition control: Process controller provides fully automatic deposition sequence.
  • Automatic gun rotation control: Positions the crucibles of a turret-type electron beam source.
  • Shutter/shutter control: Different design shutters can be incorporated depending on source configuration and number.