SEC-1000/SE-1000 Series Systems

CHA SEC-1000/SE-1000.

High Vacuum Deposition Systems

The largest of the SE/SEC-Series, the SE-1000, is typically equipped with a 25.5″ diameter, water-cooled bell jar, a 26″ diameter stainless steel baseplate, and Planetary Fixturing holding up to thirty six 4″ wafers. One Button Automation and Lift-Off Fixturing are among the most popular options added to the system.

Ultimate vacuum: 10-8 torr range

  • Ultimate vacuum: 10-8 torr range
  • Cryogenic pump: 10″
  • Mechanical pump: 23-57 CFM, dual stage
  • Cold trap: 3.7 liter capacity, 250 sq. inches of surface area, 10 hours holding time
  • Water baffle: Optically dense, chevron baffle
  • High vacuum valve: 11-3/4″ I.D., seals vertically
  • Foreline/Roughing valves: 3″ I.D.
  • Valve actuation: Electro-pneumatic (all vacuum valves)
  • Valve sequencing: Manual and automatic (Auto-Tech II)
  • Ionization gauge control: Dual ionization gauge tube, auto ranging with dual convectron positions
  • Dimensions: 79″H x 43″W x 37″D
  • Weight: 1,500 pounds
  • Utilities:
    • Electrical: 208/30/70A/5-wire connection with ground
    • Water: 10 GPM (minimum)
    • Air: 90-110 PSIG

  • Options:
    • Diffusion pump: 5300 liter/second, 10″ normal
    • Process chamber: 25.5″ diameter x 30″ H, ambient or water-cooled (32″ bell jar available)
    • Fixturing: Variety of fixturing options: planetary, clamshell, or custom
    • Baseplate: 26″ diameter, 11-3/4″ pumping port (32″ baseplate available)
    • Substrate heat: 2-10 kW
    • Sources: Any commercially available source, including single and multiple beam, CHA’s resistance and sputtering sources
    • Hoists: Motorized hoist assembly, 1/2HP motor
    • LN2 Level Control: Automatically maintains liquid level in cryogenic trap
    • Sieve trap: Molecular sieve trap prevents migration or backstreaming of mechanical pump oil into the system
    • RGA port: 2.75 O.D. flange located in base plate of system provides integration of a residual gas analyzer
    • Automatic deposition control: Process controller provides fully automatic deposition sequence
    • Automatic gun rotation control: Positions the crucibles of a turret-type electron beam source
    • Shutter/shutter control: Different design shutters can be incorporated depending on source configuration and number.
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