Mark 40® System

Combining the best features of CHA Industries’ Mark 50 system with a broad array of options, the innovative Mark 40 system represents a distinct breakthrough in vacuum deposition systems offering efficiency, flexibility and ease of maintenance. The Mark 40 accommodates a wide variety of deposition equipment, including versatile combinations of deposition sources and substrates fixturing to address virtually any application. SECS/GEM and CE compliant.

• Dual Operation, Sputtering and Evaporation
• Moving substrates
• Exceptional Film Uniformity (Fixture Dependent)
• Sputter Up
• Process Stations
  • Round Cathodes, RF or DC (Up to 4 Stations)
  • Co-deposit
  • Bias, RF or DC
  • Substrate heating, 400°C, multi-element
  • Substrate heating, station
  • Electron beam
  • Thermal
  • Ion beam pre-clean/etch
  • Plasma texturing/etch
• Power Supply Options
  • Electron beam, 6-10-15 kW
  • Sputtering, 1-3-5-15-30 KW
  • Heater, 6-10-16 kW
  • Thermal deposition, 1-5-10 kW
• Process Chamber
  • Insitu spectrophotometer
  • Drop well source
  • Easy access to front and rear door
  • Variable source-to-substrate distance
• Utilities
  • Water Supply, 10 GPM
  • Air supply, 85-125 PSIG
• Deposition Fixturing
  • Adjustable angle planet, standard
  • Vertical drum with pallets, standard
  • Rotating disk, optional
  • Rotating dome, optional
  • Flat planetary, 3 or 4, optional
  • Shutter(s), flag
• Pumping Stack
  • Dry or oil sealed roughing
  • Regeneration options
  • Famous right angle pumping/plumbing
  • Exceptional pumping performance
  • High vacuum valve, vertical seal, 16″
  • Foreline and roughing valves, vertical seal, 3″
  • Large refrigeration vapor pumping options
  • Mechanical pump, minimum CFM
  • Molecular sieve trap
  • Cold trap LN2, 25L pump trap, optional water pump
  • LN2 level control
  • Ionization gauge control
  • Gas controls
• Pumping Options
  • Cryo
  • Turbo
  • Diffusion
• Ultimate Vacuum
  • System 10 -9 Torr
  • Chamber 10 -8 Torr
• Cryo Coil
• 1,000 L/Sec. pumping speed for water vapor and other condensable gases in the process chamber
• Footprint
  • 79.5″ W x 64″D x 78.5″H (with ISO source add 21″H)