High Performance, Compact, Process Development System for Universities, R&D Labs, and More.

  • CHA's new Solution Process Development System.

  • Criterion Systems with load lock, electron beam gun, substrate heating and lift-off dome.

  • Solution with sputter cathodes and flat plate fixture.

  • Solution with sputter cathodes and flat plate fixture (swung out).

CHA's Solution™ Process Development System is a high performance, compact 48.15"D x 46"W x 78.68"H ion beam aided deposition system for processing at universities, R&D labs, etc.

For the Solution, CHA provides a variety of high quality tooling, such as lift-off dome, planetary, variable-angle and others; as well as a wide range of source choices, including swing and resistance.

  • Vacuum Chamber
    • Type: Water cooled stainless steel
    • Size: 18"D x 18"W x 24"H
    • Volume: 4.5 ft³
    • Inlet flange: NW 50
    • Source distance: 15"

  • Tooling Options
    • Lift-off dome capacity examples, 3 x 150mm/5 x 125mm/7 x 100mm/10 x 75mm
    • Planetary dome capacity examples: 9 x 100mm/12 x 75mm
    • Variable angle capacity examples: 3 x 150mm/5 x 125mm/7 x 100mm/9 x 75mm

  • Pumping Options
    • Diffusion: 1200 liters/sec
    • Turbomolecular: 320-600 liters/sec
    • Cryo: 1100 liters/sec

  • Systems Control Options
    • Manual: Autotech sequencer
    • PLC: Siemens touch screen

  • Vapor Source Options
    • Electron beam gun: 4 x 25cc/4 x 40cc/6 x 15cc/6 x 25cc
    • Resistance source
    • Swing source

  • Power Requirement Options
    • Domestic: 120VAC/60Hz, 208VAC/60Hz
    • International: 220VAC/50Hz

  • Pumping Options
    • Cryo
    • Turbo
    • Diffusion

  • Ultimate Vacuum
    • System 10 -9 Torr
    • Chamber 10 -8 Torr

  • Cryo Coil
    • 1,000 L/Sec. pumping speed for water vapor and other condensable gases in the process chamber

  • Footprint
    • 79.5" W x 64"D x 78.5"H (with ISO source add 21"H)

For more details, download the Click to download this information in PDF format.CHA Solution Datasheet (356KB).